abstract |
The present invention relates to a novel silane compound capable of improving the developability of a photosensitive resin composition with increased adhesion to a substrate, a photosensitive resin composition containing the same, and the use of the same Provided are a photosensitive material manufactured and an electronic device manufactured using the same. A silane compound of the present invention is represented by the following chemical formula (1); in the following chemical formula (1), R 1 is an alkyl group having 1 to 5 carbon atoms, and R 2 is independently halogen. Group or —C (R 3 ) 3 , R 3 is a halogen group, and a is 1 to 5. [Selection figure] None |