| abstract |
A substrate cleaning chamber, a chamber component, and a substrate cleaning method are provided. The substrate cleaning chamber includes a contoured ceiling electrode having an arcuate surface facing the substrate support, and varies across the substrate support by changing the size of the gap between the arcuate surface and the substrate support. It has a variable cross-sectional thickness for providing a plasma density. The dielectric ring for the cleaning chamber includes a base, a ridge, and a radially inward overhang covering the peripheral lip of the substrate support. The base shield includes a circular disc having at least one peripheral wall. A cleaning and conditioning process for the cleaning chamber is also described. [Selection] Figure 1 |