http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012169680-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
filingDate | 2012-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f451511b12b30df228a7eb54ff6a95cb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ef16341d194553d9fd57c461a3da285 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_19218a83f95ab9b1567f1ed1090142fa http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be48e24409d157e89d2391c8cba85f57 |
publicationDate | 2012-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2012169680-A |
titleOfInvention | Printed wiring board |
abstract | PROBLEM TO BE SOLVED: To provide a printed wiring board that can be stored in a casing of an electronic device with high density. A printed wiring board comprising a base material having flexibility and a conductor formed on at least one side of the base material, and having a bent region that is bent and a non-bent region that is not bent. The thickness of the conductor formed in the bent region is 1 to 30 μm, the thickness of the conductor formed in the non-bent region is 30 to 150 μm, and the thickness of the conductor formed in the non-bent region is A printed wiring board having a thickness greater than the thickness of the formed conductor and the thickness of the conductor formed in the bent region being 6 to 60% of the thickness of the conductor formed in the non-bent region. [Selection] Figure 1 |
priorityDate | 2005-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 70.