http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012169680-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
filingDate 2012-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f451511b12b30df228a7eb54ff6a95cb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ef16341d194553d9fd57c461a3da285
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publicationDate 2012-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2012169680-A
titleOfInvention Printed wiring board
abstract PROBLEM TO BE SOLVED: To provide a printed wiring board that can be stored in a casing of an electronic device with high density. A printed wiring board comprising a base material having flexibility and a conductor formed on at least one side of the base material, and having a bent region that is bent and a non-bent region that is not bent. The thickness of the conductor formed in the bent region is 1 to 30 μm, the thickness of the conductor formed in the non-bent region is 30 to 150 μm, and the thickness of the conductor formed in the non-bent region is A printed wiring board having a thickness greater than the thickness of the formed conductor and the thickness of the conductor formed in the bent region being 6 to 60% of the thickness of the conductor formed in the non-bent region. [Selection] Figure 1
priorityDate 2005-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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