| abstract |
A substrate material suitable for a package substrate, a rigid substrate, a flexible substrate, a copper-clad laminate, and the like, which has excellent flexibility and has excellent solder resistance even if it is thin. And a prepreg for providing the material. A prepreg obtained by impregnating a cloth with a resin composition containing the following components (A) and (B); a substrate material obtained by thermocompression bonding a copper foil to the prepreg. (A) a copolymer obtained by polymerizing a vinyl group-containing monomer and an epoxy group-containing monomer (B) a curing agent and / or a polymerization initiator [selection diagram] None |