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filingDate 2011-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0a076c2c7ebdfc4924d07244b266ad1e
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publicationDate 2012-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2012153774-A
titleOfInvention Method for producing high thermal conductive silicone rubber sponge composition
abstract A method for producing a highly thermally conductive silicone rubber sponge composition comprising an organic resin hollow filler and a thermally conductive powder, (A) A thermosetting organopolysiloxane composition containing a hollow filler made of a liquid organic resin having a viscosity of 200 Pa · s or less at 25 ° C., prepared in advance by mixing an organic resin hollow filler and an alkenyl group-containing organopolysiloxane, as well as, (B) A viscosity of 500 Pa · at 25 ° C. prepared by previously mixing the heat conductive powder having a thermal conductivity of 15 W / m · K or more with an alkenyl group-containing organopolysiloxane. s or less liquid high thermal conductive powder-containing organopolysiloxane composition, Are uniformly mixed to obtain a high thermal conductive silicone rubber sponge composition having a void volume ratio of 10 to 70%. According to the present invention, a silicone rubber sponge having a high thermal conductivity and a small heat capacity can be provided. [Selection figure] None
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