http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012119549-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2010-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ea33dc8ebd78ce7444f8fd80ac16ccf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2c240c627796a21e546d8b32d38f9dc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc7831f3c9e679cf024e942d77c21da3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea017abdb7a24765ddf385b3b6fe4422 |
| publicationDate | 2012-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2012119549-A |
| titleOfInvention | Conductive resin composition for bump formation |
| abstract | Conductivity capable of suppressing a decrease in resistance value even when heated at a high temperature in a manufacturing process and providing excellent reliability to a multilayer wiring board when used as a bump of a multilayer wiring board A resin composition is provided. A conductive resin composition used for bump formation of a multilayer substrate, comprising (A) a thermosetting resin, (B) a curing agent, (C) a curing accelerator, and (D) a filler. And a cured resin having an elastic modulus at 175 ° C. of 4000 MPa or more. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105711193-A |
| priorityDate | 2010-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 137.