http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008218901-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_17ae00da391aa3d8652ec3bd1dd0b3d3 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 |
| filingDate | 2007-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6b3a523a0746bf06fa7d73be5cc4e185 |
| publicationDate | 2008-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2008218901-A |
| titleOfInvention | Curable conductive paste composition and printed wiring board |
| abstract | Disclosed is a conductive paste that suppresses changes in viscosity over time and has excellent bump suitability. The epoxy resin is composed of an epoxy resin, a curing agent, a conductive powder, and a solvent. The epoxy resin has a softening point of 75 ° C. or lower and a trifunctional or higher functional epoxy resin of 5 to 35% by weight and a bifunctional epoxy resin 65 to 95. A curable conductive paste composition comprising: wt%, and a printed wiring board using the conductive paste composition. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012119549-A |
| priorityDate | 2007-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 41.