| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8cf8d77ac0eff1767b22d2fb9445b64d |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01K11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01K11-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01K11-12 |
| filingDate |
2011-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f757b5a931f24cc0dd29f232f963978b |
| publicationDate |
2012-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2012094875-A |
| titleOfInvention |
Accurate temperature measurement in semiconductor applications |
| abstract |
An accurate temperature measurement technique for a semiconductor manufacturing process is provided. A temperature sensing element enables accurate in situ temperature measurement. A temperature sensing element is disposed in the process chamber 302. The temperature sensing element has a cavity 306, and a transparent cover 310 is disposed so as to cover the opening of the cavity. A material 308 is disposed within the cavity of the temperature sensing element and a sensor 312 is configured to sense the material phase change through the transparent cover. [Selection] Figure 3 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022163806-A1 |
| priorityDate |
2005-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |