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filingDate 2010-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_527924b388eb5449d57b96e82ecad192
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publicationDate 2012-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2012086484-A
titleOfInvention Imprint method and transfer substrate and adhesive used therefor
abstract The present invention provides an imprint method that prevents the occurrence of transfer defects when releasing a mold and a resin layer, and a transfer substrate and an adhesive that enable such an imprint method. In an imprint method, a tetravalent atom having one hydrolyzable group and two inactive groups and a reactive functional group bonded to the atom in the adhesion layer forming step are combined. An adhesive containing the compound in the molecule is brought into contact with the substrate, and then washed to form an adhesion layer on the substrate to produce a transfer substrate. In the filling step, the mold and the adhesion layer The mold and the transfer substrate are brought close to each other so that the workpiece is interposed between them and the workpiece is filled in the transfer shape portion of the mold, and the workpiece is cured in the curing process, and the mold release process Thus, each step of separating the mold from the workpiece is provided. [Selection] Figure 3
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