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filingDate 2010-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e7b874431fb9fc91fa0ab7defeacf91
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publicationDate 2012-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2012069691-A
titleOfInvention Semiconductor device and manufacturing method thereof
abstract The present invention relates to a semiconductor device capable of efficient manufacture and a method of manufacturing the same for bonding using a copper wire. A copper electrode pad (3) formed on a substrate (2), a gold metal layer (4) provided so as to cover the electrode pad (3), and a copper bonded to the metal layer (4). And a wire 5. [Selection] Figure 1
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