http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001168483-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate | 1999-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bdd5fa335fb8eae85787f7a70bc44471 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aa29c0870a7cd987194983c3983097d6 |
| publicationDate | 2001-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001168483-A |
| titleOfInvention | Wiring board |
| abstract | (57) [Summary] [Problem] Loss occurs in a high-frequency signal propagating in a wiring layer, The semiconductor device cannot operate normally. A wiring board (4) comprising an insulating substrate (1) and a wiring layer (2) formed on the surface of the insulating substrate (1), wherein a copper plating layer (6) is formed on the surface of the wiring layer (2). Nickel plating layer 7 substantially made of an amorphous alloy And the gold plating layer 8 were sequentially applied. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012069691-A |
| priorityDate | 1999-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 42.