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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68
filingDate 2010-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2105970715e702e15ac0e27b82af7757
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publicationDate 2012-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2012041440-A
titleOfInvention Curing accelerator for epoxy resin and epoxy resin composition containing the same
abstract 【Task】 An epoxy resin composition excellent in heat resistance and low thermal expansion coefficient is provided. [Solution] Excellent heat resistance and low thermal expansion properties by uniformly and finely dispersing an epoxy resin curing accelerator containing at least a layered clay mineral organized with an organic phosphonium ion represented by the following formula (1) An epoxy resin composite material is obtained. [Chemical 1] (R 1 and R 2 in the above formula are H, CH 3 , OH, or OCH 3 groups, and n represents an integer of 1 to 22.) [Selection figure] None
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