| abstract |
An epoxy resin molding material for sealing that is non-halogen and non-antimony, has excellent reliability such as flame retardancy, moldability, reflow resistance, moisture resistance and high-temperature storage properties, and is suitable for VLSI sealing, and An electronic component device including an element sealed with the molding material is provided. A sealing epoxy resin molding material containing (A) an epoxy resin, (B) a curing agent, (C) magnesium hydroxide, and (C) magnesium hydroxide coated with silica. . [Selection figure] None |