| abstract |
PROBLEM TO BE SOLVED: To provide a non-halogen and non-antimony epoxy resin composition for encapsulation having good flame retardancy without deteriorating reliability such as moldability, reflow resistance, moisture resistance and high temperature storage characteristics. And an electronic component device provided with an element sealed with the resin composition. SOLUTION: (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E) a composite metal hydroxide, (F) a linear polyethylene oxide having a weight average molecular weight of 4,000 or more, and (G) a C5 to C30 carbon dioxide. A copolymer of an α-olefin and maleic anhydride is prepared by converting a copolymer having 5 to 2 carbon atoms. 5. An epoxy resin composition for sealing containing a compound esterified with a monohydric alcohol 5 as an essential component, and an electronic component device provided with an element sealed with the epoxy resin composition for sealing. |