| abstract |
An epoxy resin composition having excellent thermal conductivity and excellent heat resistance is provided, and a cured molded article, varnish, film adhesive, and copper foil with film adhesive obtained by using the epoxy resin composition are provided. I will provide a. In an epoxy resin composition containing an epoxy resin, a curing agent, and an inorganic filler, an epoxy resin obtained by epoxidizing dihydroxydiphenyl ether is used as an epoxy resin component in an amount of 50 wt% or more in the epoxy resin component. As an inorganic filler, a phenolic compound composed of tris (4-hydroxyphenyl) methanes or 1,1,2,2-tetrakis (4-hydroxyphenyl) ethanes is used in an amount of 50 wt% or more in the curing agent component. Epoxy resin composition obtained by adding ~ 96 wt%. [Selection figure] None |