http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009073862-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ead90443277482e25bf91bfddef2b5a7 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-18 |
| filingDate | 2007-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_efb5a731e9f6fe2bf77b1158aeff24d8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8896389057e9be1306a662309cac1896 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97958c7617122121448259d44335f7a5 |
| publicationDate | 2009-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2009073862-A |
| titleOfInvention | Epoxy resin composition for sealing and semiconductor device using the same |
| abstract | [PROBLEMS] To provide an epoxy resin composition for sealing that has a low thermal expansion property and moldability, has a high thermal conductivity when combined with an inorganic filler, and has a low thermal expansion property and excellent heat resistance and moisture resistance. Offer things. In a sealing epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, the following general formula (1) is used as an epoxy resin component: [Chemical 1] (However, n is a number of 0 or more, and m is an integer of 1 to 3.) An epoxy resin having a diphenyl ether structure represented by 50 wt% or more in the epoxy resin component is used, and the content of the inorganic filler is the total composition. The epoxy resin composition for sealing which is 80-95 mass% in a thing, and a spherical inorganic filler is 50 wt% or more in an inorganic filler component. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10961208-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012017405-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020139042-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019077859-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11767449-B2 |
| priorityDate | 2007-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 218.