http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012017222-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_781c429e4e20536916ff74dcbe1b5417 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01B33-02 |
| filingDate | 2010-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8e6679c1f2c2d2e249a696a2dd11104d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dfbd89010de167495ecf18619aa07d4e |
| publicationDate | 2012-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2012017222-A |
| titleOfInvention | Hybrid silicon wafer and manufacturing method thereof |
| abstract | A hybrid silicon wafer having the functions of both a polycrystalline silicon wafer and a single crystal wafer is provided. A wafer integrated with molten polycrystalline silicon and solid single crystal silicon and having an average crystal grain size of 8 mm within a polycrystalline portion within 10 mm from the boundary with the single crystal portion. A hybrid silicon wafer comprising the following fine crystal. A cylindrical single crystal silicon ingot is set in advance in a mold, and molten silicon is cast and integrated around the single crystal ingot to form a composite of single crystal silicon and polycrystalline silicon. A method for producing a hybrid silicon wafer, characterized by cutting into a shape. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9053942-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013183090-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013136922-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015106652-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I558864-B |
| priorityDate | 2010-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.