http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012015353-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
filingDate | 2010-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_beca91ff2b431c30c2f2347bc402ca8a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3fc07e426e44dc80b47bdc8eeaa2f95a |
publicationDate | 2012-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2012015353-A |
titleOfInvention | Polishing liquid for CMP and polishing method using this polishing liquid |
abstract | Provided are a CMP polishing liquid and a polishing method capable of achieving a high polishing rate for a low-k film as an interlayer insulating film layer while maintaining a good polishing rate for a barrier metal of a barrier layer and silicon dioxide of a cap layer. To do. A polishing slurry for CMP containing a compound having a betaine structure, (B) abrasive grains having a positive charge, (C) a metal oxide dissolving agent, and (D) an oxidizing agent is used. . In addition, the polishing is performed by using an interlayer insulating film having a raised portion and a groove on the surface, a barrier layer 2 provided following the surface of the interlayer insulating film, and a conductive layer provided to cover the barrier layer 2. A first polishing step for polishing the conductive material layer on the substrate having the material layer to expose the barrier layer 2 located on the raised portion of the interlayer insulating film; and the barrier layer 2 exposed by the first polishing step. And a second polishing step for exposing the raised portions of the interlayer insulating film by polishing using the above-described CMP polishing liquid. [Selection] Figure 2 |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016132951-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10865368-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-112017006489-T5 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2015129342-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10059860-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190091467-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015129342-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015130439-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019508880-A |
priorityDate | 2010-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 284.