| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3415
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate |
2010-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea017abdb7a24765ddf385b3b6fe4422
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc7831f3c9e679cf024e942d77c21da3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1bd3f70aeaee5ec18eff393ca36eb1d4 |
| publicationDate |
2011-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2011241343-A |
| titleOfInvention |
Resin composition and semiconductor device produced using resin composition |
| abstract |
The semiconductor device is less warped even in a high temperature environment of 220 ° C. or higher, has excellent solder connection reliability, and does not suffer from defects such as peeling and cracking, and can impart excellent reliability to the semiconductor device. A thermosetting adhesive composition is provided. A resin composition comprising a maleimide derivative (A) represented by the general formula (1) and a thermosetting resin (B) having two or more functional groups. (Wherein R1 is a linear or branched alkylene group having 1 or more carbon atoms, R2 is a linear or branched alkyl group having 5 or more carbon atoms, and the sum of the carbon atoms of R1 and R2 is 10 or less. .) [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016117860-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2019198607-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2021138873-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019198607-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7298518-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113354936-A |
| priorityDate |
2010-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |