| abstract |
To provide a highly reliable semiconductor device having excellent solder crack resistance when used as a resin composition excellent in adhesive strength, fast curability, and moisture resistance and as a die attach material for semiconductors. (A) a bismaleimide compound having a polyalkylene oxide skeleton, (B) an allyl ester compound having a polyalkylene oxide skeleton, (C) a (meth) acrylate having a hydroxycarbonyl group, and (D) a hydroxyl group ( A resin composition comprising a (meth) acrylate, (E) a radical initiator, and (F) a filler. [Selection figure] None |