http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011221084-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate | 2010-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d022b7100894971a5869a936724688a0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e2e2464730ce4f9b89575777e73084f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93c6082eaedd2a84a0c5e70c36a58e4d |
| publicationDate | 2011-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2011221084-A |
| titleOfInvention | Photosensitive resin composition, photosensitive element, and method for producing printed wiring board |
| abstract | PROBLEM TO BE SOLVED: To provide sufficient shape following property and peeling property when a resist is formed on a surface resin layer with a plating resist used for performing gold plating on a circuit of a circuit forming substrate having a surface resin layer such as a solder resist. Provided are a photosensitive resin composition, a photosensitive element, and a method for producing a printed wiring board. SOLUTION: A photosensitive resin composition containing (A) component: binder polymer (B) component: photopolymerizable compound and (C) component: photoinitiator, wherein (A) component is (meta ) A binder polymer having a weight average molecular weight of 80,000 to 120,000 consisting of 20 to 30% by weight of acrylic acid and 70 to 80% by weight of (meth) acrylic acid alkyl ester, and as the component (B), a bisphenol A type (meth) A photosensitive resin composition comprising an acrylate compound, an alkoxylated trimethylolpropane tri (meth) acrylate compound, and a nonylphenyl polyalkylene glycol (meth) acrylate compound. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018024791-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I551949-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020026607-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6165943-B1 |
| priorityDate | 2010-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 150.