abstract |
The present invention provides a resin composition having excellent moisture and heat resistance when formed into a molded body as compared with the case without this configuration. A resin composition includes (A) ammonium polyphosphate, (B) an acid acceptor, (C) an epoxy group-containing silicone compound, (D) a condensed phosphate ester, and (E) a chain length extension. And (F) polylactic acid. [Selection figure] None |