| abstract |
PROBLEM TO BE SOLVED: To provide an adhesive film for semiconductor processing that enables uniform and flat back grinding of a semiconductor wafer, can easily peel off a base film from an adhesive layer, and does not easily deteriorate the performance of the adhesive layer. thing. The adhesive film for semiconductor processing of the present invention has a release layer, an adhesive layer, a separation layer and a base film in this order on a carrier tape, and is used for processing a semiconductor wafer. The adhesive layer, the separation layer, and the base film are formed in a wafer shape that is approximately the same size as the semiconductor wafer to be processed. [Selection] Figure 1 |