| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ead90443277482e25bf91bfddef2b5a7 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 |
| filingDate |
2010-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b01ee0b0ea296ffb6d34a3d9cc085af9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_793266548d9d55418bfc7282f149dbdc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_260627d07072798880c124f2ef4e6a9e |
| publicationDate |
2011-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2011157440-A |
| titleOfInvention |
Adhesive resin composition, coverlay film and circuit board |
| abstract |
An adhesive resin composition for a circuit board such as a flexible printed wiring board is provided. The structural units represented by the following general formulas (1) and (2): The adhesive resin composition containing the polyimide resin containing this. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10244626-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016194055-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015125021-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109438702-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015037555-A1 |
| priorityDate |
2010-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |