| abstract |
To provide an adhesive film capable of satisfactorily embedding unevenness caused by a plurality of circuits on a circuit board, and to provide a semiconductor device, a multilayer circuit board, and an electronic component using such an adhesive film. . An adhesive film of the present invention is used when a semiconductor chip or a semiconductor package is mounted on a circuit board on which a circuit is formed, and is an adhesive film having a flux function. The adhesive film is attached to the circuit board. The pasting temperature when pasting on the surface on which the circuit is formed is T [° C.], the pressure applied to the adhesive film is P [Pa], and the melt viscosity of the adhesive film at the pasting temperature is η [Pa · s]. When satisfied, the relationship of 1.2 × 10 3 ≦ (T × P) /η≦1.5×10 9 is satisfied, the pasting temperature T is 60 to 150 ° C., and the pressure P is 0.2. The melt viscosity η of the adhesive film at a pasting temperature of −1.0 MPa is 0.1 to 10,000 Pa · s. [Selection figure] None |