| abstract |
Provided are a terminal provided with a conductor penetrating a cured prepreg, and a method for manufacturing an electronic device having the terminal. At least one opening is formed in the prepreg. The prepreg is attached to the substrate on which the electronic element is formed so that the opening constituting the conductor constituting the terminal overlaps. In the prepreg, a conductive paste is provided in a region where an opening is provided. Part of the conductive paste flows into the opening and comes into contact with the conductor constituting the terminal. Then, heat treatment is performed to cure the conductive paste and prepreg. In the process of forming the terminals, it is not necessary to perform a step of forming an opening with a laser beam after the prepreg is cured, so that the influence of the laser beam on the electronic element can be eliminated. [Selection] Figure 1 |