| abstract |
(57) [Problem] To easily control a gap for forming an insulating layer, which is advantageous for mass production, and furthermore, it is possible to make the entire substrate thinner, which is also advantageous for flattening the substrate surface. Provided are a method for manufacturing a multilayer wiring board, and a multilayer wiring board obtainable by the manufacturing method. SOLUTION: A plurality of double-sided wiring substrates 10 having wiring patterns 12 formed on both surfaces of an insulating layer 11 are laminated via a prepreg 1 in which a thermosetting resin is impregnated in a resin porous film, and the lamination is performed. A method for manufacturing a multilayer wiring board, comprising a step of heating and pressurizing an object to integrate them. |