http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011066181-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
filingDate 2009-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1a7ffd04ad7f12cffeb24b3e51cd0ebf
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publicationDate 2011-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2011066181-A
titleOfInvention Printed wiring board and manufacturing method thereof
abstract An exposure of a via opening that enables stable and accurate inspection of the appearance quality of the opening pattern of the via or has a strong correlation with the occurrence of a defect in the via opening pattern. Provided is a printed wiring board and a method for manufacturing the same, which can stably and accurately inspect whether or not copper (Cu) is eluted in a land portion. At least one of the copper wiring patterns 3 has a land portion 5 exposed at an opening of a via 7 and an exposed area of the land portion 5 at a position different from the land portion 5. Is connected to a copper (Cu) elution detection lead 9 provided so that the surface is exposed in a small area, and the surface of the copper (Cu) elution detection lead 9 is electroless tin (Sn) plated A film is formed. [Selection] Figure 1
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Total number of triples: 25.