http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002246724-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K101-42 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-382 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-066 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2001-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dda73b23adf520d1bdfd6277a1a06cd1 |
| publicationDate | 2002-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002246724-A |
| titleOfInvention | Wiring board manufacturing method |
| abstract | (57) [Problem] To prevent a penetration of a wiring conductor layer even when a laser beam is irradiated on a resin insulating layer through a pinhole in a dielectric layer of a mask to form a defective hole, thereby preventing the wiring conductor layer from penetrating. Eliminate short circuit with the wiring conductor layer formed on the resin insulation layer. SOLUTION: A wiring conductor layer 2 and resin insulating layers 3 and 4 are formed on an upper surface of an insulating substrate 1, and a through hole 4 c reaching the upper surface of the wiring conductor layer 2 is formed in the resin insulating layers 3 and 4. 3, 4 when forming the thin film wiring conductor layer on the Is formed by applying a first resin insulating layer 3 so as to cover the wiring conductor layer 2, forming a guide through hole 3 a reaching the upper surface of the wiring conductor layer 2 in the first resin insulating layer 3, A second resin insulating layer 4 is formed on the first resin insulating layer 3 so as to cover the guide through hole 3a, and the second resin insulating layer 4 is formed via a mask 5 having an opening 5a at the position of the guide through hole 3a. Irradiation of laser light 7 from above the layer 4 is performed to reach the upper surface of the wiring conductor layer 2. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011066182-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011066181-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008016687-A |
| priorityDate | 2001-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.