http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011037036-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_962adbf7d50e742218f3d536a63df612 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-08 |
| filingDate | 2009-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_259f5f75cef78824c87aca71ff2bf217 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a94685883de0bf7a9188b1d78b823566 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c747557f6d5760edf5eb2643c9d5cab8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f1055cc6ac9661a1c68e4b57169329fe |
| publicationDate | 2011-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2011037036-A |
| titleOfInvention | Release sheet |
| abstract | To provide a release sheet capable of forming a through hole with high dimensional accuracy and position accuracy with respect to a resin sheet on which a through hole is to be formed. A release sheet according to the present invention is a release sheet that is temporarily attached to a resin sheet in which a through hole is to be formed and is used to form a through hole in a resin sheet in which a through hole is to be formed. A material film, a first resin layer that is provided on a surface opposite to a surface temporarily attached to a resin sheet on which a through-hole of the base film is to be formed, and that is mainly composed of a resin material; It is provided on the surface side temporarily attached to the resin sheet to form the through-hole, and has a second resin layer mainly composed of a resin material, and thermomechanical analysis of the base film (measuring condition: in nitrogen, The softening temperature A measured by a heating rate of 5 ° C./min) is 180 ° C. or higher, and is measured by thermogravimetric analysis (measuring condition: heating rate of 5 ° C./min in nitrogen) of the first resin layer. The 10% mass reduction temperature B is 180 to 280 ° C. [Selection figure] None |
| priorityDate | 2009-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.