| abstract |
The present invention provides a circuit board member that does not cause deformation such as shrinkage or is hardly deformed even when a hole is formed by a laser or the like, a method for manufacturing the same, and a method for manufacturing a circuit board. SOLUTION: The circuit board member of the present invention is a circuit board member (103) provided with a release film (101, 101 ') on at least one side of a prepreg (102), and is provided on the release film (101, 101'). A heat absorbing substance having a heat absorbing property is contained or applied. The method for manufacturing a circuit board member of the present invention, at least one side of the prepreg (102), contains a heat absorbing substance having a heat absorbing property or a coated release film (101, 101 ') is adhered by heating and pressing. In manufacturing the circuit board member, the heating temperature is set to be equal to or higher than the softening point of the prepreg and equal to or lower than the heat absorption temperature of the endothermic substance. [Selection diagram] FIG. |