http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010267818-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
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filingDate 2009-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3449dc281bf7e86c3252513a50ed9702
publicationDate 2010-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2010267818-A
titleOfInvention Semiconductor substrate cleaning liquid and semiconductor substrate cleaning method using the same
abstract A semiconductor substrate cleaning solution capable of reliably removing residues present on a semiconductor substrate after dry etching and / or ashing in semiconductor manufacturing and suppressing corrosion of the semiconductor substrate having a low-k film altered layer, etc. And a method of cleaning a semiconductor substrate using the same. SOLUTION: A semiconductor substrate cleaning solution containing hydrofluoric acid, boric acid having a saturation solubility of not more than 0.10 mol times with respect to hydrofluoric acid, and water, and the semiconductor substrate cleaning solution A method for cleaning a semiconductor substrate. [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2017208767-A1
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type http://data.epo.org/linked-data/def/patent/Publication

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