http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010267818-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6c8d4dc7bd1a30d8fda907fceaeb4e69 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
filingDate | 2009-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3449dc281bf7e86c3252513a50ed9702 |
publicationDate | 2010-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2010267818-A |
titleOfInvention | Semiconductor substrate cleaning liquid and semiconductor substrate cleaning method using the same |
abstract | A semiconductor substrate cleaning solution capable of reliably removing residues present on a semiconductor substrate after dry etching and / or ashing in semiconductor manufacturing and suppressing corrosion of the semiconductor substrate having a low-k film altered layer, etc. And a method of cleaning a semiconductor substrate using the same. SOLUTION: A semiconductor substrate cleaning solution containing hydrofluoric acid, boric acid having a saturation solubility of not more than 0.10 mol times with respect to hydrofluoric acid, and water, and the semiconductor substrate cleaning solution A method for cleaning a semiconductor substrate. [Selection figure] None |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2017208767-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11397383-B2 |
priorityDate | 2009-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 60.