http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010256729-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0388 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4246 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-30 |
filingDate | 2009-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da1ac94bd4b2a0f0956ed03d835a39ac http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8ce14d57c22ac7419b44969604a6fb5 |
publicationDate | 2010-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2010256729-A |
titleOfInvention | Photo-curable thermosetting resin composition, dry film and cured product thereof, and printed wiring board using them |
abstract | A photocurable thermosetting resin having excellent insulation reliability and chemical resistance and capable of forming a cured film having PCT resistance, HAST resistance, and electroless gold plating resistance, which are important as solder resists for semiconductor packages. Provided are a composition, a dry film and a cured product thereof, and a printed wiring board on which a cured film such as a solder resist is formed. A photocurable thermosetting resin composition that can be developed with a dilute alkaline aqueous solution includes: (A) a carboxyl group-containing resin (excluding a carboxyl group-containing resin starting from an epoxy resin), (B) A photopolymerization initiator and (C) an amino resin having an alkoxymethyl group are contained. The carboxyl group-containing resin (A) preferably does not contain a hydroxyl group, and preferably has a photosensitive group. In a preferred embodiment, the photocurable thermosetting resin composition further contains (D) a thermosetting component, and preferably further contains a colorant (G). [Selection figure] None |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012141387-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2015022885-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015045685-A |
priorityDate | 2009-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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