| abstract |
The present invention provides a photosensitive resin composition that is excellent in remaining film properties during pattern processing and has very little shape change due to heat treatment, and a metal resin composite using the same. (A) an alkali-soluble polyimide and / or an alkali-soluble polyimide precursor, (b) an aliphatic di (meth) acrylate derived from a long-chain polyol in which a linking group is defined, and (c) a photopolymerization initiator. A photosensitive resin composition comprising: [Selection figure] None |