| abstract |
To provide a thermosetting resin composition excellent in transparency, heat resistance, heat yellowing resistance and the like. A thermosetting resin composition comprising an organosilicon compound obtained by a hydrosilylation reaction of the compounds represented by the following (A), (B), and (C), and the compound and a curing agent. (A) Silsesquioxane having two or more Si—H groups in one molecule and having a molecular weight of 100 to 500,000. (B) Silicone and / or silsesquioxane having two or more alkenyls in one molecule and a molecular weight of 100 to 500,000. (C) A compound having one or more epoxy or oxetanyl and alkenyl having 2 to 18 carbon atoms in one molecule. [Selection figure] None |