http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010208023-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-16
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filingDate 2009-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c882a8d10321681c65c22225115d85ab
publicationDate 2010-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2010208023-A
titleOfInvention Inkjet head manufacturing method and inkjet head
abstract An inkjet head manufacturing method capable of controlling the positional relationship between a pressure generating element, an ink flow path, and an ejection port with high accuracy and good reproducibility. A step of laminating a first resin layer and a positive resist layer containing silicon atoms on a substrate on which the pressure generating element is formed, and reduction relative to the positive resist layer containing silicon atoms. A step of patterning a part of the ink flow path pattern by performing i-line exposure and development processing using a projection exposure apparatus, and dry etching using oxygen plasma using the positive resist layer containing the silicon atoms as a mask. A step of patterning one resin layer to form an ink flow path pattern; a step of forming a coating resin layer around the ink flow path pattern; and exposing and developing the coating resin layer to form the discharge port And a step of dissolving and removing the ink flow path pattern. [Selection] Figure 4
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