http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010153632-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_063a1b324005ddc15e16e7529c6258c4 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2008-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38a68b301b21d566152735b1ee619f10 |
| publicationDate | 2010-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2010153632-A |
| titleOfInvention | Lead, wiring member, package component, resin-coated metal component, resin-encapsulated semiconductor device, and manufacturing method thereof |
| abstract | A semiconductor device having good electrical connectivity and bonding strength by suppressing generation of resin burrs and a method of manufacturing the same are provided. Provided are an LED device capable of improving the adhesion between a silicone resin and a wiring lead and exhibiting excellent light emission characteristics, and a method for manufacturing the LED device. Provided are an LED device that has sufficient reflectivity and can exhibit excellent luminous efficiency even when emitting light in a relatively short wavelength region, and a method for manufacturing the LED device. Provided is a film carrier tape capable of maintaining excellent manufacturing efficiency, avoiding damage to a wiring pattern layer during an Sn plating process, and exhibiting excellent formation of a Sn plating layer, mechanical strength, and bondability, and a manufacturing method thereof. . An organic coating is formed on the surface of a boundary region of an outer lead of a QFP by self-organization of functional organic molecules. The functional organic molecule 11 includes a metal-bonding first functional group A1, a main chain portion B1, and a second functional group C1 that exhibits a curing action of a thermosetting resin. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10395947-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012174746-A |
| priorityDate | 2008-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 59.