| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate |
2002-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7cc1048f6c2ad9ec0be2ecca9d3c885 |
| publicationDate |
2004-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2004200349-A |
| titleOfInvention |
Semiconductor lead frame and semiconductor device using the same |
| abstract |
A lead frame having excellent solder resistance and a semiconductor device are provided. A semiconductor lead frame which is surface-treated with a surface treatment agent containing a disulfide compound, more preferably a disulfide compound represented by the general formula (1), and a semiconductor device using the same. Embedded image (In the formula, R1 and R2 are an alkyl group or an aryl group having 2 to 18 carbon atoms. R1 and R2 may be the same or different.) |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010153632-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007266562-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010199234-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7989930-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8946746-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9017822-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010073660-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9960325-B2 |
| priorityDate |
2002-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |