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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L51-00
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filingDate 2008-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c31dc056b19800323a30103d57f8067
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publicationDate 2010-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2010084083-A
titleOfInvention Epoxy resin composition
abstract [PROBLEMS] To achieve excellent adhesion performance even when used for adhesion of adherends having fine irregularities on a surface such as an electronic material, wherein the fluidity is optimized and excellent in adhesion. Providing epoxy resin that does not corrode adherends. An epoxy resin composition mainly comprising an epoxy resin (A), core-shell particles (B) and a curing agent (C), wherein the shell is 0.5 to 20.0 in the core-shell particles (B). The core and the shell are made of a specific polymer, the core-shell particles (B) have a specific particle diameter, and the mass ratio of the epoxy resin (A) to the core-shell particles (B) is , (A) :( B) = 100: 5 and less than 150, and the total concentration of sodium ions and potassium ions is 20 ppm or less. [Selection figure] None
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