| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73ebc284a55d5daf0e209d6186c9e65c |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0218 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D17-006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-097
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F9-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F9-00 |
| filingDate |
2008-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2c63b77d8a205daad70f4bcff4a02a1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5715aa4a0d7a688723a7088bbab1b3e4 |
| publicationDate |
2010-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2010047807-A |
| titleOfInvention |
Composite metal thin film particles, composite metal thin film particle dispersion, conductive circuit manufacturing ink, conductive circuit manufacturing method, and conductive circuit |
| abstract |
Provided are a composite metal thin film particle for conductive ink, conductive ink, a method for manufacturing the conductive circuit, and a conductive circuit, which are used for manufacturing a conductive circuit having high conductive performance at low cost with simple equipment. A first step of forming a composite metal thin film layer including at least a resin layer or a wax layer and a metal or metal compound layer on the surface of a sheet-like base material 501; and the composite metal thin film layer as a sheet It consists of the 2nd process which peels from. Thereby, the composite metal thin film particle and conductive ink which can be used for the apparatus which manufactures the conductive circuit patterned by liquid processes, such as a screen printing method and the inkjet method, can be obtained. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013093131-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014040644-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7341820-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015096628-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015096627-A |
| priorityDate |
2008-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |