| abstract |
PROBLEM TO BE SOLVED: To provide an abrasive and a polishing method capable of efficient and high-speed polishing and easy process management in CMP technology for flattening an interlayer insulating film, a BPSG film, a shallow trench isolation insulating film and the like. SOLUTION: N-mono-substituted, containing cerium oxide particles, a dispersant, a water-soluble polymer and water, wherein the water-soluble polymer is selected from the group consisting of acrylamide, methacrylamide and α-substituted products thereof. And a N, N-di-substituted compound having a skeletal structure, preferably 0.01 parts by weight or more and 10 parts by weight or more of the water-soluble polymer with respect to 100 parts by weight of the abrasive. Less than parts by weight. [Selection figure] None |