| abstract |
(57) [PROBLEMS] To provide a cleaning agent which has a low environmental load and has a high cleaning effect on impurities remaining on a semiconductor component such as a semiconductor substrate after chemical mechanical polishing (CMP); and An object of the present invention is to provide a polishing composition used for polishing a surface of a semiconductor component such as a semiconductor substrate, a recording medium component and an optical component. SOLUTION: Among a (co) polymer having a carboxylic acid (salt) group, a (co) polymer having a sulfonic acid (salt) group, and a (co) polymer having a phosphonic acid (salt) group, A polishing composition containing at least two kinds of (co) polymers and, if necessary, a detergent for semiconductor components containing a phosphonic acid compound, and a polishing aid comprising the above-mentioned detergent for semiconductor components. |