| abstract |
Embodiments of the present invention provide an apparatus such as a processing chamber suitable for etching high aspect ratio features. In other embodiments, various chamber components are disclosed that can achieve good process results during high aspect ratio etching. For example, in one embodiment, a processing chamber is provided that includes a chamber body in which a showerhead assembly and a substrate support assembly are disposed. The showerhead assembly includes at least two fluid separated plenums, a region that transmits optical measurement signals, and a plurality of gas passages formed through the showerhead assembly to fluidly couple the plenum to an interior volume of the chamber body. It has. In other embodiments, at least one of a novel cathode liner, an upper outer liner, a lower outer liner, a substrate support assembly, a lid assembly, a showerhead assembly, and a quartz ring are provided, which have high aspect ratio features. Useful for plasma etching. [Selection] Figure 1 |