| abstract |
The present invention relates to an improved copper plating bath for forming a copper layer on a printing cylinder and a method of using the same. A copper plating bath comprises a) a copper ion source, b) a methanesulfonate ion source, c) a chloride ion source, d) a formula: RSR′-SO 3 -X + , or X + -. An organic sulfur compound having O 3 SR′-SRRSR—SO 3 —X + (wherein R is alkyl, hydroxyalkyl, or alkyl ether, R ′ is C 2 -C 4 alkyl) Group, and X + is a cation), and e) a polyether compound. The copper plating bath produces a plating coating that has a stable hardness and does not self-anneal during high speed plating. [Selection] Figure 1 |