| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e415f6f1eeb8706d299ea086326248bf |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-242
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-241 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-02 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate |
2002-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9364218ea54f0906e0588c0a81ee5580
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c5ee17b742b5a1783afba3d6cdd7fd9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f7f0bca750f1e19d113ec0567207f90
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e70fd0fb63d101a30e2ac6674cc11df5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5708886def30803a3fcb304639f42e46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_27d6fdf6a6f4d810ebdfedd6b41e5c13 |
| publicationDate |
2003-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2003183875-A |
| titleOfInvention |
Plating bath and method for depositing a metal layer on a substrate |
| abstract |
(57) [Summary] (Modified) [Problem] To provide a plating bath and method for improving metal deposition on a substrate by incorporating into the plating bath a heteroatom-containing organic compound that prevents decomposition of the plating bath additive. To do. By adding a heteroatom-containing organic compound that suppresses consumption of the additive to the plating bath, deterioration of the additive is prevented. The additive consumption inhibiting compound provides a long-life plating bath and a uniform and highly glossy metal layer having good physical and mechanical properties on the substrate. The metal plating method involves immersion in a bath containing dissolved plating metal, bath additives and / or higher additive consumption inhibiting compounds 2 A desired thickness of plating can be obtained by passing an electric current between the two electrodes. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101633725-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014055355-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007080839-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014519555-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006283169-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014037634-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5094418-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010248552-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009533555-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007297646-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012117113-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007501899-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017053031-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150130141-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10793956-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4589695-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013133495-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013129890-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017043834-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006124794-A |
| priorityDate |
2001-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |