http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009263601-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2008-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_157e2281826d36d35c02985559ad5380 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4fc1170e72bea4d3c4050033b0bb077f |
| publicationDate | 2009-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2009263601-A |
| titleOfInvention | Epoxy resin molding material for sealing and electronic component device |
| abstract | The present invention provides an epoxy resin molding material for sealing and an electronic component device that have improved characteristics evaluated by a bias test or the like under high temperature and high humidity, have a long life, and are excellent in moisture resistance reliability. In a sealing epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler, a cured product of the epoxy resin molding material. The sealing epoxy resin molding material whose density | concentration of the chloride ion in the extract extracted from the pure water of 121 to 121 degreeC for 20 hours is 20 ppm or less. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2017030126-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013197531-A |
| priorityDate | 2008-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 207.