| abstract |
PROBLEM TO BE SOLVED: To provide a non-halogen and non-antimony epoxy resin material having good flame retardancy without deteriorating reliability such as moldability, reflow resistance, moisture resistance, and high-temperature storage characteristics, and the like. To provide an electronic component device provided with an element sealed by the method. SOLUTION: (A) an epoxy resin, (B) a curing agent, (C) In an epoxy resin molding material containing a composite metal hydroxide as an essential component, 1 g of a crushed product of a molded product of this material is used. The sodium ion (Na + ) concentration of the extracted water extracted at 121 ° C. and 2 atm with 10 ml of water per 2 atmospheres is 3 ppm or less, the chloride ion (Cl − ) concentration is 3 ppm or less, and the electric conductivity is 100 μS / cm or less, and pH 5.0 to 9. An epoxy resin molding material for sealing, which is 0. |