http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009260115-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-265
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filingDate 2008-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b41696c51b6c41710b3d6e83088be621
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publicationDate 2009-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2009260115-A
titleOfInvention Method for manufacturing silicon carbide semiconductor device
abstract PROBLEM TO BE SOLVED: To reduce impurities mixed in a carbon protective film for preventing step bunching and to reduce defects generated in the carbon protective film and a silicon carbide wafer, and to perform a process from formation of the carbon protective film to annealing treatment. A method for manufacturing a silicon carbide semiconductor device that can be performed continuously in a semiconductor device and provides a method for stabilizing the quality of silicon carbide semiconductor devices, improving yield, and reducing manufacturing costs. obtain. A step of supplying a hydrocarbon gas containing oxygen to thermally decompose the hydrocarbon gas containing oxygen under reduced pressure to form a carbon protective film 6 on the entire surface of a silicon carbide wafer 24; A step of performing an annealing process on the silicon carbide wafer 24 on which the carbon protective film 6 is formed under reduced pressure by stopping the supply gas of the hydrocarbon gas to be contained and supplying an inert gas with one film forming and annealing apparatus. I was able to do it continuously. [Selection] Figure 9
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013129869-A
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Total number of triples: 40.