| abstract |
In a conventional polishing pad, since there is unevenness in thickness, the polishing characteristics for each polishing pad are unstable, and the time required for start-up is long because the polishing characteristics are stable. Long was the problem. (1) A laminate comprising a polishing layer having a compression modulus of 3 MPa or more and 10 MPa or less and a cushion layer having a compression modulus of 2 MPa or more and 10 MPa or less, and the difference between the maximum thickness and the minimum thickness is 50 μm or less. A polishing pad, wherein the value obtained by dividing the thickness variation of the laminate by the thickness of the cushion layer is 0.15 or less. (2) A method for producing a polishing pad, comprising laminating a polishing layer and a cushion layer and then grinding the surface of the polishing layer. [Selection figure] None |