| abstract |
【Task】 The present invention provides a polishing pad used to form a flat surface in glass, semiconductor, dielectric / metal composite, integrated circuit, etc., and has a stable polishing rate and is excellent in in-plane uniformity. A polishing pad and a polishing apparatus are provided. [Solution] In the polishing pad of the present invention, as a first means, in the polishing pad composed of at least a polishing layer and a cushion layer, the cushion layer is non-foamed, and the arithmetic average roughness Ra of the polishing layer side surface Is not less than 0.6 μm and not more than 20.0 μm. The polishing apparatus of the present invention is characterized by mounting such a polishing pad. [Selection figure] None |